FLEXO MARKET NEWS NOVEMBER 4th EDITION - page 6

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November 4, 2013
Flexo Market News
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The world’s finest selection of flexo materials.
A&V offers the world’s finest selection of flexo materials.
Like nyloflex® NExT high-output UV technology and thin plate
technology from Flint Group; new flat dot technology from
Toyobo; plus in-the-round technology and direct laser engraving.
A&V supports these materials with over 50 years of flexo
experience and the finest technical support. Great materials
and great service... that’s a hard combination to beat.
PIA Supports Introduction
Of Innovation Act of 2013
Printing Industries of America issued a statement in
support of the introduction of The Innovation Act of
2013.This bipartisan legislation aims to address the re-
cent abuses of the legal system by patent-assertion en-
tities, or “patent trolls.” It is estimated that more than
$29 billion per year is wasted on these lawsuits, and
that does not account for the loss of innovation.This
bill would increase transparency, discourage frivolous
patent litigation, and update current U.S. patent laws.
“Instead of focusing on innovation and job cre-
ation, many businesses, including printing compa-
nies, have to devote significant resources to
defending against these costly lawsuits,” said Lisbeth
Lyons,Vice President of Government Affairs.“Abusive
patent litigation is a strain on the economy, leading to
truly wasted capital — capital that could have been
used to create jobs or fund further innovation in the
marketplace.”
“Printing Industries of America continues to push
for passage of this legislation to encourage patent
holders to use their technology to further incentivize
creativity,” Lyons continued, “rather than extort ex-
pensive settlements from downstream users.”
Student Scholarship Winners
Participate In PACK EXPO
PACK EXPO owner and producer PMMI,The Associa-
tion for Packaging and Processing Technologies, has
long provided travel scholarships to help college-age
students from PMMI partner schools attend PACK
EXPO. But merely attending PACK EXPO is a thing of
the past. Today’s student attendees participate in the
show, as was evident at PACK EXPO Las Vegas 2013,Sep-
tember 23–25 at the LasVegas Convention Center.
Clemson University’s graduate students presented
one of the clearest examples of how students could
be part of PACK EXPO Las Vegas with a display of eye
tracking technology — the third time the program
has been part of PACK EXPO. Esko sponsored the ex-
hibit, and the Clemson students used it to test pack-
aging concepts from a consumer goods
manufacturer. This year marked the first time for a
“live” test of the software.
The PACK Solutions Challenge provided a longer-
term challenge. School teams were tasked with solv-
ing a typical packaging and processing line
challenge.The students begin their work before head-
ing to the show, then meet with exhibitors on site,
and present their solutions to a panel of judges.
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